Free Solder Balls, Tin Sphere 0.4mm for BGA Reballing and Packaging, with Sn96.5 Ag3 Cu0.5 Alloy for Chip Circuit PCB Electronic Signal Transmission

[Precise Size for Professional Use] With a consistent diameter of 0.4mm (0.016 inches), these ultra-small spherical solder balls are perfect for ic packaging and bga reballing. the uniform size ensures reliable connections for semiconductor chips, pcbs, and various circuit templates requiring ​ electronic signal transmission. [Improved Reliability & Performance] Special trace elements have been added to enhance oxidation resistance and overall solder ball reliability. this advanced formulation strengthens soldering capabilities while maintaining excellent conductivity for stable electronic signal transmission in demanding applications. [Large Quantity Value Pack] Each package contains approximately 250000 solder balls, providing ample supply for multiple bga rework projects. the generous quantity makes this an economical choice for professional technicians and electronics repair workshops handling frequent reballing tasks. [​ ​k>​ Free Material] These premium bga solder balls are made of ​ sn96.5%/ag3%/cu0.5% alloy that meets rohs standards. the refined material composition ensures excellent soldering performance while being completely ​k>​k>​>-​free for safer electronics manufacturing and repair applications. [Versatile Electronics Application] Ideal for various professional applications including bga chip reballing, package soldering, pcb repair, and electronic component maintenance. these solder balls are widely used in connecting semiconductor devices, circuit boards, and other electronic assemblies requiring reliable connections. Spec: Conditon: 100% Brand New Item Type: ​k>​‑Free Solder Ball Material: Sn96.5% / Ag3% / Cu0.5% Specification: Approx.0.4mm / 0.016in 250,000 grains Application: Suitable for Chip BGA reballing, BGA package soldering, filling, maintenance Package List: 1 x Bottle of Tin Balls

• [Precise Size for Professional Use] With a consistent diameter of 0.4mm (0.016 inches), these ultra-small spherical solder balls are perfect for ic packaging and bga reballing. the uniform size ensures reliable connections for semiconductor chips, pcbs, and various circuit templates requiring electronic signal transmission.
• [Improved Reliability & Performance] Special trace elements have been added to enhance oxidation resistance and overall solder ball reliability. this advanced formulation strengthens soldering capabilities while maintaining excellent conductivity for stable electronic signal transmission in demanding applications.
• [Large Quantity Value Pack] Each package contains approximately 250000 solder balls, providing ample supply for multiple bga rework projects. the generous quantity makes this an economical choice for professional technicians and electronics repair workshops handling frequent reballing tasks.
• [ Free Material] These premium bga solder balls are made of sn96.5%/ag3%/cu0.5% alloy that meets rohs standards. the refined material composition ensures excellent soldering performance while being completely -free for safer electronics manufacturing and repair applications.
• [Versatile Electronics Application] Ideal for various professional applications including bga chip reballing, package soldering, pcb repair, and electronic component maintenance. these solder balls are widely used in connecting semiconductor devices, circuit boards, and other electronic assemblies requiring reliable connections.